Heat3D Thermal Simulation Dataset: Synthetic 3D Heat-Conduction Data for Operator Learning
This repository is the main dataset entry point for the Heat3D project. It is intended to collect multiple synthetic 3D heat-conduction subsets for operator learning research.
The root index currently highlights:
subsets/v0_unitcube_demo/: a prototype UnitCube dataset for checking data loading, 3D graph construction, training, and evaluation workflows.subsets/heat3d_v6_p1h_shared_support1024_v0/: the canonical V6 layered package dataset with 1,024 group-locked cases, one shared ordered 1,024-node support, and a reusable 240,825-node full-field archive.
Historical subset paths remain in place even when they are not listed in this short root index. All data are synthetic. The prototype subset is feasibility-oriented; the V6 P1h subset represents a frozen layered-package simulation contract but should not be interpreted as measured hardware data.
Repository Structure
README.md
DATASET_INDEX.md
metadata/
schema.md
versions.json
subsets/
v0_unitcube_demo/
README.md
metadata.json
samples/
sample_000/
sample_001/
...
heat3d_v6_p1h_shared_support1024_v0/
README.md
manifest.json
full_fields.h5
p1g_g000_t0_b0_p0/
...
Current Subsets
See DATASET_INDEX.md for the subset list and version status.
Code and canonical V6 subset
The associated code repository is:
https://github.com/133754144/heat3d-ic
The default V6-layer subset used by the current codebase is:
subsets/heat3d_v6_p1h_shared_support1024_v0/
The UnitCube subset remains available for lightweight workflow validation.
Related Code
The associated research codebase is:
https://github.com/133754144/heat3d-ic
Scope
This dataset family is designed to support steady 3D thermal field prediction from thermal conductivity fields and localized heat source fields. Future subsets may add more complex geometries, material interfaces, boundary conditions, package scenarios, TSV structures, micro-bumps, chiplet stacks, and transient heat-conduction settings.